EP3SE260F1517C2N vs EP3SE260F1517I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2N sa pamamagitan ng Intel at EP3SE260F1517I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517C2N | EP3SE260F1517I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total Memory Bits | 16,672,768 | — |
| Maximum User I/Os | 976 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Maximum Core Frequency | 600 MHz | — |
| Packhaging | 1517-ball FC-BGA | 1517-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG, Active Serial | — |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Speed Grade | C2 | -3 (fastest) |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 976 |
| Temperature Grade | — | Industrial (I): -40 °C to +100 °C |
| Temperature ng Junction na Operasyon | — | -40 °C to +100 °C |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | — | Yes (dedicated multiply-accumulate) |