EP3SE260F1517C4L vs EP3SE260F1517C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4L sa pamamagitan ng Altera at EP3SE260F1517C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C4L | EP3SE260F1517C4N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix III E | Field-Programmable Gate Array (FPGA) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | — |
| Number of User I/O | 976 | — |
| Packhaging | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 0.9 V |
| Maximum Operating Frequency | 450 MHz | — |
| Number of Transceivers | 16 | — |
| Transceiver Data Rate (Max) | 1.25 Gbps | — |
| Multiplier Blocks (18x18) | 384 | — |
| Total TriMatrix Memory | 15.04 Mbits (MLAB + M9K + M144K) | — |
| PLLs | 4 per quadrant + 8 fractional PLLs | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0°C to 85°C |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | Stratix® III E |
| Embedded Memory | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Process Node | — | 65 nm |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |