EP3SE260F1517C4L vs EP3SE260F1517I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4L sa pamamagitan ng Altera at EP3SE260F1517I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C4L | EP3SE260F1517I3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | — |
| Number of User I/O | 976 | — |
| Packhaging | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.0 V typical |
| Maximum Operating Frequency | 450 MHz | — |
| Number of Transceivers | 16 | — |
| Transceiver Data Rate (Max) | 1.25 Gbps | — |
| Multiplier Blocks (18x18) | 384 | — |
| Total TriMatrix Memory | 15.04 Mbits (MLAB + M9K + M144K) | — |
| PLLs | 4 per quadrant + 8 fractional PLLs | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Operating Temperature Grade | — | Industrial |
| Junction Temperature Range | — | -40C to +125C |
| Maximum Core Frequency | — | 717 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Configuration | — | SRAM-based, volatile (requires external configuration device) |