EP3SE260F1517I3 vs EP3SE260F1517C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3 sa pamamagitan ng Intel at EP3SE260F1517C4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I3 | EP3SE260F1517C4 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III E | Stratix® III E FPGA |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | — |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Tindminan RoHS | Compliant | Compliant (per Altera product page) |
| Configuration | SRAM-based, volatile (requires external configuration device) | — |
| Series | — | Stratix III E |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 10,200 LABs / 10200 ALMs (per Mouser listing) |
| User I/O Count | — | 976 |
| DSP Blocks | — | 768 (18x18 multipliers per Mouser listing) |
| Ball Count | — | 1517 |
| Package Style | — | Flip-Chip BGA |
| Speed Grade | — | -4 |
| Temperature na Operasyon | — | Commercial (0C to +85C) - inferred from C4 suffix |
| Process Node | — | 40 nm |
| Lead-Free | — | Yes |