EP3SE260H780C2N vs EP3SE260H780C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C2N sa pamamagitan ng Intel at EP3SE260H780C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Huling PagbiliIntel
EP3SE260H780C4 - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel / Altera
EP3SE260H780C4 ObsoletePagsanggunian na paghahambing
| Parametro | EP3SE260H780C2N | EP3SE260H780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 780-BGA FCBGA | 780-ball FCBGA (H780) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Hanay ng Temperature na Operasyon | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C4 |
| Level ng MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | Stratix III E |
| Total Memory Bits | — | 16,672,640 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 488 |
| Embedded Multipliers (18x18) | — | 576 |
| Distributed Memory | — | 1,020 Kbits |
| Number of PLLs | — | 8 |
| Auxiliary Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |