EP3SE260H780I3 vs EP3SE260H780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I3 sa pamamagitan ng Intel at EP3SE260H780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780I3 | EP3SE260H780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 | — |
| Embedded 18x18 Multipliers | 384 | — |
| User I/Os | 488 | — |
| Operating Frequency (logic) | 500 MHz | — |
| Operating Frequency (internal max) | 800 MHz | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Packhaging | 780-Ball FC-HFBGA / FCBGA | 780-ball FCBGA (Flip Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 Hours) | 3 (168 hours) |
| Tindminan RoHS | Lead Free / Compliant | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Logic Array Blocks (LABs) | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Maximum Core Clock Frequency | — | 450 MHz |
| Configuration Method | — | Serial/Parallel via Quartus II |