EP3SE260H780I4 vs EP3SE260H780I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4 sa pamamagitan ng Intel at EP3SE260H780I4LN sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260H780I4LN - 255k LE Stratix III E FPGA | Altera | 780-BGA
EP3SE260H780I4LN ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780I4 | EP3SE260H780I4LN |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Packhaging | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (HBGA) |
| Temperature na Operasyon | -40C to +100C (industrial, 'I' grade) | — |
| Speed Grade | 4 | -4 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Series | — | EP3SE260 |
| Total Memory Bits | — | 16,672,640 |
| Maximum User I/O | — | 488 |
| Process Node | — | 65 nm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Package Code | — | BGA, 780 terminal, SQUARE |
| Lead-Free / RoHS | — | Lead-free, e1 (per JESD-609) |
| Programming Tool | — | Quartus II Design Suite |