EP3SE50F484C2N vs EP3SL50F484C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C2N sa pamamagitan ng Intel at EP3SL50F484C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484C2N | EP3SL50F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III E | — |
| Family | Stratix III E FPGA | Stratix III L (low-power) |
| Logic Elements | 47,500 | 47,500 |
| Embedded Memory | 2,304 Kbits | — |
| DSP Blocks (18x18) | 264 | — |
| User I/Os | 296 | — |
| LABs/CLBs | 1,900 | — |
| Core Voltage | 0.9 V / 1.1 V | — |
| Internal Frequency | 600 MHz | — |
| Process Technology | 65 nm | 40 nm CMOS (TSMC) |
| Packhaging | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) | 484-BBGA, FCBGA (FineLine BGA) |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 C to 85 C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Device Type | — | FPGA |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory Bits | — | 2,184,192 |
| Maximum Internal Frequency | — | 800 MHz |
| User I/O Pins | — | 296 |
| Core Supply Voltage | — | 0.9 V |
| Configuration Memory | — | SRAM-based (volatile, requires external flash/EPC) |
| Speed Grade | — | C2 (slower of Stratix III commercial) |