EP3SE50F484C3 vs EP3SE50F780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C3 sa pamamagitan ng Altera at EP3SE50F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484C3 | EP3SE50F780C3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Device Family | Stratix III E (Enhanced) | — |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (M9K + M144K) | 5,760 Kbits | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/Os | 296 | 488 |
| User I/O Banks | [DATA_NEEDED: number of user I/O banks] | — |
| High-Speed Transceivers | [DATA_NEEDED: package-dependent count for 484-FBGA] | — |
| Internal Operating Frequency | Up to 800 MHz | — |
| Process Technology | 40 nm TSMC | 65 nm |
| Speed Grade | C3 (mid) | — |
| Temperature na Operasyon | 0C to 85C (Commercial) | 0C to +85C (Commercial grade, 'C' suffix) |
| Supply Voltage (Core) | [DATA_NEEDED: nominal core voltage] | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 780-ball FC-FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Lead-Free / RoHS | [DATA_NEEDED: lead-free / RoHS status from manufacturer] | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Family | — | Stratix III E |
| Embedded Memory (BRAM) | — | 5,760 Kbits |
| Core Voltage | — | 1.1 V |
| Logic Voltage | — | 0.9 V |
| Transceiver Speed (max) | — | 500 MHz |
| Total LABs/CLBs | — | 1900 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |