EP3SE50F484C4LN vs EP3SE50F484C4LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C4LN sa pamamagitan ng Intel at EP3SE50F484C4LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484C4LN | EP3SE50F484C4LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix® III E |
| Logic Elements (LE) | 47,500 | — |
| LABs/CLBs | 1900 | — |
| Total RAM Bits | 2,344,448 (2286 Kbit) | — |
| Number of I/O | 296 | — |
| Number of Multipliers (18x18) | 384 | — |
| Voltage - Supply (Core) | 0.85 V to 1.1 V | — |
| Voltage - Supply (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Packhaging / Kaso | 484-BBGA, FCBGA (FineLine BGA) | — |
| Lead Free / RoHS | Lead free / RoHS compliant | — |
| Process Node | 40 nm CMOS | 40 nm TSMC |
| Speed Grade | C4 | -4 |
| Configuration | FPP / AS / JTAG | — |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.49 Mbit (2,886 Kbit M9K + M144K blocks) |
| Maximum User I/O | — | 296 |
| Hardware Multipliers (18x18) | — | 384 |
| PLLs | — | 4 |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Hanay ng Temperature na Operasyon | — | 0°C to +85°C (Commercial) |
| Packhaging | — | 484-Ball FCBGA, 23 x 23 mm |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Quartus II 11.0 or later |