EP3SE50F484I3 vs EP3SL50F484C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I3 sa pamamagitan ng Intel at EP3SL50F484C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I3 | EP3SL50F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III E | Stratix III L (low-power) |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory | 5,760 Kbits | — |
| User I/Os | 296 | — |
| Process Technology | 65 nm | 40 nm CMOS (TSMC) |
| Core Voltage | 1.1 V | — |
| Packhaging | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-BBGA, FCBGA (FineLine BGA) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | C2 (slower of Stratix III commercial) |
| DSP Blocks | Yes (embedded multipliers and accumulators) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Device Type | — | FPGA |
| Embedded Memory Bits | — | 2,184,192 |
| Maximum Internal Frequency | — | 800 MHz |
| User I/O Pins | — | 296 |
| Core Supply Voltage | — | 0.9 V |
| Temperature na Operasyon | — | 0 C to 85 C (commercial) |
| Configuration Memory | — | SRAM-based (volatile, requires external flash/EPC) |