EP3SE50F484I4 vs EP3SE50F484I4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I4 sa pamamagitan ng Intel at EP3SE50F484I4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I4 | EP3SE50F484I4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LAB) | 1,900 | — |
| Maximum User I/O | 296 | — |
| Embedded Memory (Bits) | 5,760,000 | — |
| DSP Blocks (18x18 Multipliers) | 216 | — |
| Process Technology | 65 nm CMOS | 40 nm low-power CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 450 MHz | — |
| Packhaging | 484-ball FC-FBGA | 484-Ball FCBGA (FineLine BGA) |
| Package Code | BBGA / FC-FBGA | — |
| Temperature / Speed Grade | I4 (Industrial) | — |
| Temperature ng Junction na Operasyon | -40 C to +100 C | — |
| Tindminan RoHS | Compliant | Compliant (lead-free 'G' suffix) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.49 Mbit |
| User I/Os | — | 296 I/O |
| Supply Voltage na Operasyon | — | 1.1 V (core) |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Speed Grade | — | 4 |
| Style ng Pagpapasok | — | SMD/SMT |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | Up to 12 (Stratix III E family) |
| External Memory Support | — | DDR3, DDR2, QDR II/II+ |