EP3SE50F484I4 vs EP3SL50F484C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I4 sa pamamagitan ng Intel at EP3SL50F484C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I4 | EP3SL50F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III E (Enhanced) | Stratix III L (low-power) |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LAB) | 1,900 | — |
| Maximum User I/O | 296 | — |
| Embedded Memory (Bits) | 5,760,000 | — |
| DSP Blocks (18x18 Multipliers) | 216 | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS (TSMC) |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 450 MHz | — |
| Packhaging | 484-ball FC-FBGA | 484-BBGA, FCBGA (FineLine BGA) |
| Package Code | BBGA / FC-FBGA | — |
| Temperature / Speed Grade | I4 (Industrial) | — |
| Temperature ng Junction na Operasyon | -40 C to +100 C | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Device Type | — | FPGA |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory Bits | — | 2,184,192 |
| Maximum Internal Frequency | — | 800 MHz |
| User I/O Pins | — | 296 |
| Core Supply Voltage | — | 0.9 V |
| Temperature na Operasyon | — | 0 C to 85 C (commercial) |
| Lead-Free | — | Yes |
| Configuration Memory | — | SRAM-based (volatile, requires external flash/EPC) |
| Speed Grade | — | C2 (slower of Stratix III commercial) |