EP3SE50F484I4LG vs EP3SE50F484C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I4LG sa pamamagitan ng Intel at EP3SE50F484C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel
EP3SE50F484I4LG ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I4LG | EP3SE50F484C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Series | Stratix III E | — |
| Family | Stratix III (Enhanced) | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| LABs/CLBs | 1,900 | — |
| Total Embedded Memory | 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source) | — |
| Number of DSP Blocks | 104 (18x18 multipliers) | — |
| Number of PLLs | 8 | — |
| User I/O Count | 296 | — |
| Core Supply Voltage (Vccint) | 0.86 V to 1.15 V (1.1 V nominal) | — |
| Hanay ng Temperature na Operasyon | -40C to +100C (Industrial, TJ) | — |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| Packhaging | 484-ball FBGA / FCBGA | 484-ball FC-FBGA |
| Packaging | Tray | — |
| Process Technology | 40 nm CMOS | 65 nm CMOS |
| Configuration Interface | Passive Serial / Fast Passive Parallel / JTAG | — |
| Bitstream Encryption | 256-bit AES | — |
| Tindminan RoHS | Compliant | — |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory | — | 5,760 Kbits (M9K + M144K + MLAB) |
| Embedded Multipliers (18x18) | — | 384 |
| Maximum User I/Os | — | 296 |
| Speed Grade | — | -4 (performance-oriented) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Core Voltage (typical) | — | 0.9 V |
| PLLs | — | 12 |
| Lead-Free Finish | — | Yes (L suffix) |
| Level ng MSL | — | 3 (168 hours) |