EP3SE50F484I4N vs EP3SL50F484I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I4N sa pamamagitan ng Intel at EP3SL50F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I4N | EP3SL50F484I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Device Family | Stratix III E | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory (TriMatrix) | 2,136 Kbits | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/Os | 296 | — |
| I/O Banks | 12 | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Maximum User I/O Frequency | 800 MHz (per DigChip datasheet summary) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Packhaging | 484-ball FC-FBGA (F484) | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Temperature na Operasyon | 0 C to +85 C (Industrial) | 0 °C to +85 °C (commercial) |
| Speed Grade | I4 | — |
| Lead-Free / RoHS | Lead-free (per ampheo listing) | [DATA_NEEDED: lead-free/RoHS status] |
| Family | — | Stratix III L (Low Power) |
| Device Logic Elements | — | 47,500 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/O | — | 296 |
| Internal Operating Frequency | — | 500 MHz |
| Uri ng Pagpapasok | — | Surface Mount |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |
| Transceivers | — | Stratix III L — supports high-speed serial transceivers per family datasheet |