EP3SE50F780C2N vs EP3SE50F780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C2N sa pamamagitan ng Intel at EP3SE50F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780C2N | EP3SE50F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5,760,000 bits | — |
| DSP Blocks | Yes (number not in source data) | — |
| User I/O Count | 488 | 488 |
| Transceiver Channels | 12 (data rate not in source data) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V to 1.1 V | 1.1 V |
| Maximum Internal Clock Frequency | 600 MHz | — |
| Packhaging | 780-ball FC-FBGA (FBGA-780) | 780-BBGA, FC-FBGA |
| Speed Grade | C2 | — |
| Temperature Grade | Commercial (C2) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 47,500 |
| LABs / CLBs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Operating Frequency | — | Up to 600 MHz |
| Tindminan RoHS | — | [DATA_NEEDED: current RoHS status] |
| Number of Pins / Terminals | — | 780 |
| Form of Terminal | — | Ball |
| Package Code | — | BGA |
| Operating Temperature Grade | — | Commercial (C2) |