EP3SE50F780C3 vs EP3SL70F780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C3 sa pamamagitan ng Intel at EP3SL70F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780C3 | EP3SL70F780C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 47,500 | 67,500 |
| Embedded Memory (BRAM) | 5,760 Kbits | — |
| User I/Os | 488 | — |
| Packhaging | 780-ball FC-FBGA (FineLine BGA) | 780-BBGA, FC-FBGA |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | — |
| Logic Voltage | 0.9 V | — |
| Transceiver Speed (max) | 500 MHz | — |
| Total LABs/CLBs | 1900 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Temperature na Operasyon | 0C to +85C (Commercial grade, 'C' suffix) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | Stratix III L |
| Embedded Memory (bits) | — | 2,699,264 |
| Logic Array Blocks (LABs) | — | 2,700 |
| User I/O Count | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Number of Pins / Balls | — | 780 |
| Core Voltage (VCCINT) | — | 1.1 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Hanay ng Temperature na Operasyon | — | 0°C to 85°C (commercial) |
| Speed Grade | — | C3 |
| Design Software | — | Quartus II (last supported v13.1) |