EP3SE50F780C3G vs EP3SE50F780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C3G sa pamamagitan ng Altera at EP3SE50F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780C3G | EP3SE50F780C4L |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III E | Stratix III E |
| Manufacturer | Altera (now Intel) | — |
| Family | Stratix III E enhanced FPGA | Stratix III |
| Number of Logic Elements (LE) | 47,500 LE | — |
| Number of Adaptive Logic Modules (ALM) | 19,000 ALM | — |
| Embedded Memory | 5.49 Mbit (5,760,000 bit) | 5,760,000 bits |
| Number of User I/O | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Supply Voltage | 1.1 V | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | [DATA_NEEDED: full industrial/commercial grade] |
| Speed Grade | C3 | C4 (commercial, speed 4) |
| Packhaging / Kaso | 780-BBGA, FCBGA (Flip-Chip) | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Katayuan ng Lifecycle | Not Recommended for New Designs (NRND) | — |
| Configuration Memory | External (EPCS / flash) | — |
| Logic Elements (LE) | — | 47,500 |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Packhaging | — | 780-ball FCBGA (Flip-Chip BGA) |
| Process Node | — | 40 nm |
| Core Voltage | — | 1.1 V |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |