EP3SE50F780C4G vs EP3SE50F780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C4G sa pamamagitan ng Intel at EP3SE50F780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780C4G | EP3SE50F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III E | Stratix III E |
| Series | Stratix III | — |
| Logic Elements | 47,500 LE | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.76 Mbit (5760000 bit) | — |
| Number of I/Os | 488 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count from datasheet] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Process Technology | 40 nm TSMC | 65 nm |
| Core Supply Voltage | 1.1 V | — |
| Hanay ng Temperature na Operasyon | 0 C to +85 C (commercial) | — |
| Packhaging | 780-ball FBGA (FCBGA) | 780-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Design Software | Quartus II | — |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (M9K blocks) | — | 312 |
| Total Embedded Memory | — | 5,760 Kbit (5.76 Mbit) |
| DSP Blocks | — | 432 |
| Maximum User I/Os | — | 488 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 1.1 V |
| Speed Grade | — | C3 (medium) |
| Temperature Grade | — | Commercial (0C to +85C) |