EP3SE80F1152C2 vs EP3SE80F1152C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C2 sa pamamagitan ng Intel at EP3SE80F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera
EP3SE80F1152C4 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SE80F1152C2 | EP3SE80F1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III E | Stratix III Enhanced |
| Logic Elements | 80,000 | 80,000 |
| Logic Array Blocks (LABs) | 3,200 | 3200 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V | — |
| Internal Operating Frequency | up to 600 MHz | — |
| Temperature na Operasyon | 0 C to 85 C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C2 | — |
| Packhaging | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) |
| Package Code | F1152 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III E |
| Device Type | — | FPGA |
| Total RAM Bits | — | 6,843,392 |
| Core Voltage | — | 1.1 V |
| Internal Frequency (max) | — | 800 MHz |
| Configuration Method | — | SRAM-based, JTAG / EPCS serial |
| DSP Blocks | — | Yes (variable-precision, 18x18 multipliers) |