EP3SE80F1152I4 vs EP3SE260F1152I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152I4 sa pamamagitan ng Intel at EP3SE260F1152I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152I4 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel (Altera)
EP3SE80F1152I4 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SE80F1152I4 | EP3SE260F1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix III E | — |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Embedded Memory (bits) | 6,843,392 | — |
| User I/Os | 744 | — |
| Maximum Operating Frequency | 800 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage | 1.1 V | — |
| Packhaging | 1152-ball FineLine BGA (FCBGA) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Temperature na Operasyon | -40 °C to +100 °C TJ (industrial, 'I' grade) | -40C to +100C (Industrial) |
| Speed Grade | I4 (fastest industrial) | I3 (Industrial, speed bin 3) |
| Configuration | JTAG IEEE Std 1149.1 boundary-scan | — |
| Architecture | ALM-based Adaptive Logic Module | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lifecycle | Last Time Buy / Legacy (Intel FPGA legacy program) | — |
| Series | — | Stratix III E (EP3SE260) |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Core Voltage | — | 1.1 V |
| Maximum Fabric Frequency | — | 500 MHz |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Product Status | — | Obsolete (per Xecor comparator) |