EP3SE80F1152I4N vs EP3SE80F1152C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152I4N sa pamamagitan ng Intel at EP3SE80F1152C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152I4N | EP3SE80F1152C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Series | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| Embedded Memory Bits | 6,843,392 bits | — |
| User I/O Count | 744 | — |
| Packhaging | 1152-BBGA, FCBGA (flip-chip) | FBGA-1152, 35x35 mm |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 450 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | I4 | C3 |
| Uri ng Memory | SRAM-based configuration | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) | — |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant (per distributor listing) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Device Family | — | Stratix III E |
| Logic Array Blocks (LABs) | — | 3,200 |
| User I/Os | — | 744 |
| Embedded Memory | — | 6,843,392 bits |
| Internal Frequency | — | 800 MHz |
| Maximum DSP Block Frequency | — | 717 MHz |
| Core Supply Voltage | — | 1.1 V |
| Temperature na Operasyon | — | 0 to 85 C (Commercial) |
| Transceivers | — | 12 full-duplex channels (family-dependent) |
| Design Software | — | Quartus II |