EP3SE80F780C2N vs EP3SE260H780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F780C2N sa pamamagitan ng Intel at EP3SE260H780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE80F780C2N | EP3SE260H780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| Embedded Memory | 6,843,392 bits | M9K and M144K blocks |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Packhaging | 780-Ball FC-FBGA | 780-ball FCBGA (Flip Chip BGA) |
| Package Code | F780 | — |
| Speed Grade | C2 | — |
| Maximum Operating Frequency | 600 MHz | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Logic Elements | — | 255,000 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Core Voltage | — | 0.86 V to 1.15 V |
| Maximum Core Clock Frequency | — | 450 MHz |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | 3 (168 hours) |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Configuration Method | — | Serial/Parallel via Quartus II |