EP3SL200H780C2N vs EP3SL200H780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C2N sa pamamagitan ng Intel at EP3SL200H780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C2N | EP3SL200H780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III L | — |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | 488 |
| Embedded Memory Bits | 10,901,504 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | — |
| Transceivers | Per family capability - not specified for this OPN | [DATA_NEEDED: transceiver count for H780] |
| Packhaging | 780-ball HBGA / FCBGA | 780-BBGA, FCBGA |
| Package Code | PBGA780 / HBGA-780 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | Commercial (0C to +85C) | 0C to +85C (Commercial) |
| Lead Free | Yes | Yes |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Stratix III L |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 65 nm |
| Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |