EP3SL200H780C2N vs EP3SL200H780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C2N sa pamamagitan ng Intel at EP3SL200H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C2N | EP3SL200H780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III L | — |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | 488 |
| Embedded Memory Bits | 10,901,504 | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | -4 (medium performance, commercial) |
| Transceivers | Per family capability - not specified for this OPN | — |
| Packhaging | 780-ball HBGA / FCBGA | — |
| Package Code | PBGA780 / HBGA-780 | BGA-780 / PBGA780 / HBGA-780 |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | Commercial (0C to +85C) | 0C to 85C (commercial) |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | 6.5 Mbit |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Configuration Modes | — | FPP, AS, PS, JTAG |