EP3SL200H780C4L vs EP3SL200H780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C4L sa pamamagitan ng Intel at EP3SL200H780C3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C4L | EP3SL200H780C3 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | — |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | 3 (slowest of Stratix III bins) |
| Temperature na Operasyon | 0C to 85C (commercial) | Commercial grade (0C to +85C, exact range [DATA_NEEDED]) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: confirmed in datasheet] |
| Process Technology | TSMC 40 nm | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Device | — | EP3SL200 |
| Packhaging | — | 780-ball FCBGA (H780) |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/O Pins | — | 488 |
| Embedded Memory Bits | — | 10,901,520 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | 3 (168 Hours) |
| Sub-Family | — | Stratix III L (lower-power logic variant) |
| Transceivers | — | [DATA_NEEDED: count and speed] |
| DSP Blocks | — | [DATA_NEEDED: count] |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED] |