EP3SL200H780I3 vs EP3SL200F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I3 sa pamamagitan ng Intel at EP3SL200F1152I4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SL200F1152I4N - Stratix III L 200K LE FPGA | Altera | Industrial
EP3SL200F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL200H780I3 | EP3SL200F1152I4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | Stratix III |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (industrial) |
| Packhaging | 780-BBGA, FCBGA (HBGA-780) | 1152-ball FC-FBGA (F1152) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Logic Array Blocks (LABs) | — | 8,000 |
| Adaptive Logic Modules (ALMs) | — | 80,160 |
| User I/Os | — | 744 |
| Total Embedded Memory Bits | — | 10,901,504 (approx. 10.9 Mbit) |
| Embedded Multipliers (18x18) | — | Yes (DSP blocks) |
| Transceivers | — | Multi-gigabit SERDES MGTs |
| Core Voltage (Vccint) | — | 1.1 V |
| Speed Grade | — | I4 (industrial, slowest) |
| Configuration | — | AES-128 bitstream encryption supported |
| Tindminan RoHS | — | Compliant |