EP3SL340F1760I3 vs EP3SL340F1760C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760I3 sa pamamagitan ng Intel at EP3SL340F1760C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Huling PagbiliIntel
EP3SL340F1760C4N - 340K LE Stratix III L FPGA | Intel | 1120 I/O
EP3SL340F1760C4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL340F1760I3 | EP3SL340F1760C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix III L | — |
| Logic Elements | 337,500 LE | 337,500 |
| LABs (Logic Array Blocks) | 13,500 | — |
| Embedded Memory Bits | 18,822,144 bit | 18,822,144 bits |
| User I/Os | 1120 | — |
| Number of Pins / Balls | 1760 | — |
| Package Type | FC-FBGA (1760-ball, FineLine BGA) | — |
| Package Code | BGA1760, 42x42, 40 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | — |
| Temperature na Operasyon | -40 °C to 100 °C (Industrial grade, I3 suffix) | Commercial (0C to +85C) [DATA_NEEDED: exact grade from datasheet] |
| Speed Grade | I3 (Industrial, mid-speed bin) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (Pb-free BGA balls) | Compliant (lead-free BGA balls) |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] | — |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Level ng MSL | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) | — |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 13,500 |
| Embedded 18x18 Multipliers | — | 1,125 |
| User I/O Count | — | 1120 |
| Process Node | — | 65 nm |
| Maximum Operating Frequency | — | 450 MHz |
| Packhaging | — | 1760-ball FC-FBGA |
| Lead-Free (Pb-Free) | — | Yes (N suffix per JEDEC J-STD-609) |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |