EP3SL340F1760I3N vs EP3SL340F1760I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760I3N sa pamamagitan ng Intel at EP3SL340F1760I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL340F1760I3N EP3SL340F1760I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III L —
Logic Elements 337,500 337,500 LE
Logic Array Blocks (LABs) 13,500 —
Embedded Memory Bits 18,821,144 bits 18,822,144 bit
Maximum User I/O 1120 —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V 1.1 V
Packhaging 1760-ball FC-FBGA (Flip-Chip BGA) —
Ball Pitch 1.0 mm —
Temperature na Operasyon -40C to +100C (Industrial) -40 °C to 100 °C (Industrial grade, I3 suffix)
Speed Grade I3 I3 (Industrial, mid-speed bin)
Configuration Method JTAG / Serial / Parallel —
Tindminan RoHS Compliant Compliant (Pb-free BGA balls)
Lead-Free Yes —
Design Software Quartus II (legacy) —
Series — Stratix III L
LABs (Logic Array Blocks) — 13,500
User I/Os — 1120
Number of Pins / Balls — 1760
Package Type — FC-FBGA (1760-ball, FineLine BGA)
Package Code — BGA1760, 42x42, 40
Uri ng Pagpapasok — Surface Mount
Configuration Memory — SRAM-based, volatile (requires external configuration device)
Transceivers — [DATA_NEEDED: transceiver count and data rate for this F1760 variant]
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
PLLs — [DATA_NEEDED: PLL count]
Level ng MSL — MSL3 (JEDEC J-STD-020, reflow 245 °C peak)

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