EP3SL340F1760I4N vs EP3SL340F1760I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760I4N sa pamamagitan ng Intel at EP3SL340F1760I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL340F1760I4N | EP3SL340F1760I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 337,500 | 337,500 |
| Embedded Memory | 18,822,144 bits | — |
| User I/Os | 1,120 | — |
| Logic Array Blocks (LABs) | 13,500 | 13,500 |
| Maximum Operating Frequency | 717 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Packhaging | 1760-ball FC-BGA | 1760-ball FC-FBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Speed Grade | I4 | I3 |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Memory Interfaces | DDR, DDR2, DDR3, QDRII+, RLDRAM | — |
| DSP Blocks | Dedicated, distributed across fabric | — |
| Embedded Memory Bits | — | 18,821,144 bits |
| Maximum User I/O | — | 1120 |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | JTAG / Serial / Parallel |
| Design Software | — | Quartus II (legacy) |