EP3SL340H1152C3N vs EP3SE260F1152C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340H1152C3N sa pamamagitan ng Intel at EP3SE260F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SL340H1152C3N | EP3SE260F1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III L | — |
| Logic Elements | 337,500 | — |
| User I/O Count | 744 | 744 |
| Number of LABs/CLBs | 13,500 | — |
| Total RAM Bits | 18,822,144 | — |
| Supply Voltage (Core) | 1.1 V | — |
| Process Node | 65 nm | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 C to +85 C (Commercial) |
| Packhaging | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | 3 | — |
| Configuration Memory | SRAM (volatile) | — |
| Bilang ng Pins | 1152 | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Stratix III E |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |