EP3SL50F484C2 vs EP3SE50F484C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F484C2 sa pamamagitan ng Intel at EP3SE50F484C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F484C2 - 47.5K LE Stratix III E FPGA | Intel | 484-FCBGA
EP3SE50F484C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL50F484C2 | EP3SE50F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III L (low-power) | Stratix III Enhanced (Stratix III E) |
| Device Type | FPGA | — |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory Bits | 2,184,192 | — |
| Maximum Internal Frequency | 800 MHz | — |
| User I/O Pins | 296 | 296 |
| Packhaging | 484-BBGA, FCBGA (FineLine BGA) | 484-ball FC-FBGA (FCBGA) |
| Process Technology | 40 nm CMOS (TSMC) | 65 nm |
| Core Supply Voltage | 0.9 V | 1.1 V |
| Temperature na Operasyon | 0 C to 85 C (commercial) | [DATA_NEEDED: full temp range for C2 suffix] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Memory | SRAM-based (volatile, requires external flash/EPC) | — |
| Speed Grade | C2 (slower of Stratix III commercial) | C2 (commercial, fast) |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory (M9K + MLAB) | — | 5,760,000 bits |
| Maksimum na Taktiko ng Oras | — | 600 MHz |
| Pitch | — | [DATA_NEEDED: ball pitch of FC-FBGA-484] |
| Configuration Interface | — | JTAG / Active Serial (AS) |
| DSP Blocks | — | 18x18 dedicated multipliers |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |