EP3SL50F484C4L vs EP3SL50F484C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F484C4L sa pamamagitan ng Intel at EP3SL50F484C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F484C4L | EP3SL50F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obs | Huling Pagbili |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| User I/O Count | 296 | — |
| Total RAM Bits | 2,184,192 | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS (TSMC) |
| Hanay ng Temperature na Operasyon | 0°C to 85°C (commercial) | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-BBGA, FCBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Maximum Fabric Frequency | [DATA_NEEDED: maximum fabric frequency] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | Compliant | Compliant |
| Design Software | Quartus II | — |
| Architecture | Adaptive Logic Module (ALM) | — |
| Device Type | — | FPGA |
| Logic Elements | — | 47,500 |
| Embedded Memory Bits | — | 2,184,192 |
| Maximum Internal Frequency | — | 800 MHz |
| User I/O Pins | — | 296 |
| Core Supply Voltage | — | 0.9 V |
| Temperature na Operasyon | — | 0 C to 85 C (commercial) |
| Lead-Free | — | Yes |
| Configuration Memory | — | SRAM-based (volatile, requires external flash/EPC) |
| Speed Grade | — | C2 (slower of Stratix III commercial) |