EP3SL50F780C2 vs EP3SL50F780C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C2 sa pamamagitan ng Intel at EP3SL50F780C4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F780C2 | EP3SL50F780C4 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory (bits) | 2,184,192 | — |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FC-FBGA |
| Temperature na Operasyon | 0°C to +85°C (commercial) | 0C to +85C (Commercial) |
| Maximum Core Frequency | 600 MHz | — |
| Configuration Interface | JTAG / passive serial / fast passive parallel | JTAG / Serial |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces | — |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 47,500 |
| Embedded Memory | — | 2,184,192 bits |
| User I/Os | — | 488 |
| Speed Grade | — | C4 |
| Design Tool | — | Quartus II |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |