EP3SL50F780I3G vs EP3SE50F780I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780I3G sa pamamagitan ng Intel at EP3SE50F780I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL50F780I3G - Stratix III L FPGA, 47.5K LE, 780-BGA | Intel
EP3SL50F780I3G ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SL50F780I3G | EP3SE50F780I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III L | Stratix III E |
| Logic Elements | 47,500 LE | — |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 2.08 Mbit | 8.7 Mbits (M9K + M144K blocks) |
| Total Memory Bits | 2,184,192 bit | — |
| User I/Os | 488 I/O | — |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Temperature na Operasyon | -40C to +100C | -40C to +100C (Industrial, I3) |
| Speed Grade | I3 (industrial) | 3 |
| Packhaging | 780-ball FCBGA (F780) | 780-pin FC-FBGA (F780) 29x29 mm |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Level ng MSL | 3 (per JEDEC J-STD-020) | 3 |
| Logic Elements (LE) | — | 47,500 |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| DSP Blocks | — | 264 (18x18 multipliers) |
| Maximum User I/O Pins | — | 488 |
| Transceivers | — | 12 channels, up to 3.75 Gbps |
| Core Voltage | — | 1.1 V |
| Memory Interfaces | — | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM |
| PCI Express Hard IP | — | Gen1 x1/x4/x8 |