EP3SL70F484C2 vs EP3SL50F484C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484C2 sa pamamagitan ng Intel at EP3SL50F484C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F484C2 | EP3SL50F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III L | — |
| Family | Stratix III L FPGA | Stratix III L (low-power) |
| Logic Elements | 67,500 | 47,500 |
| Embedded Memory | 2,699,264 bits | — |
| Logic Array Blocks (LABs) | 2,700 | 1,900 |
| User I/O Count | 296 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 40 nm CMOS (TSMC) |
| Maximum Core Frequency | 600 MHz | — |
| Package Type | 484-ball FC-FBGA (FineLine BGA) | — |
| Package Pin Count | 484 | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 C to 85 C (commercial) |
| Speed Grade | C2 | C2 (slower of Stratix III commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Device Type | — | FPGA |
| Embedded Memory Bits | — | 2,184,192 |
| Maximum Internal Frequency | — | 800 MHz |
| User I/O Pins | — | 296 |
| Packhaging | — | 484-BBGA, FCBGA (FineLine BGA) |
| Core Supply Voltage | — | 0.9 V |
| Lead-Free | — | Yes |
| Configuration Memory | — | SRAM-based (volatile, requires external flash/EPC) |