EP3SL70F484I4 vs EP3SL70F484I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484I4 sa pamamagitan ng Intel at EP3SL70F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F484I4 EP3SL70F484I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Series Stratix III L —
Family Stratix III Stratix III L
Logic Elements (LE) 67,500 —
Embedded Memory (bits) 2,699,264 —
Logic Array Blocks (LABs) 2,700 2,700
Embedded Multipliers (18x18) 488 —
Maximum User I/O 296 —
Packhaging 484-BBGA, FCBGA 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch
Uri ng Pagpapasok Surface Mount —
Core Voltage 1.0 V —
Temperature na Operasyon -40C to +100C (industrial) -40C to +100C (industrial)
Process Technology 40 nm CMOS —
Tindminan RoHS Compliant Compliant
Uri ng Memory TriMatrix (10 Kb / 640-bit MLAB) —
PLL Count 8 high-speed + 16 general-purpose —
Logic Elements — 67,500
Adaptive Logic Modules (ALMs) — 33,000
Total Embedded Memory — 2,699,264 bits (337 KB)
M9K Memory Blocks — 288
M144K Memory Blocks — 12
DSP Blocks (18x18 multipliers) — 384
User I/O Pins — 296
Transceivers — Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package]
PLLs — 8 (4 enhanced PLLs + 4 fast PLLs)
Process Node — TSMC 40 nm
Speed Grade — -3 (mid-tier)
Configuration Modes — FPP, AS, PS, JTAG, AES encryption
Design Software — Quartus II (legacy)

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