EP3SL70F780C3N vs EP3SL70F780C4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C3N sa pamamagitan ng Intel at EP3SL70F780C4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780C3N | EP3SL70F780C4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Stratix III L | — |
| Logic Elements | 67,500 | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,750 | — |
| Embedded Memory Bits | 2,699,264 bits (2.699 Mbit) | — |
| Embedded Multipliers (18x18) | 488 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | — |
| Number of I/O Banks | 8 | — |
| Bilang ng Pins | 780 | 780 |
| Package Type | 780-ball FC-FBGA (29x29 mm) | 780-FBGA (FCBGA) |
| Hanay ng Temperature na Operasyon | Commercial (0C to +85C) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant |
| Level ng MSL | 3 (per JEDEC J-STD-020) | 3 (per JEDEC J-STD-020) |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total RAM Bits | — | 2,699,264 |
| User I/O Pins | — | 488 |
| Package Dimensions | — | 29 x 29 mm |
| Core Voltage Range | — | 0.86 V to 1.15 V |
| Temperature ng Junction na Operasyon | — | 0C to 85C (commercial) |
| Design Software | — | Quartus II (legacy Stratix III support) |