EP3SL70F780C4L vs EP3SL70F780I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C4L sa pamamagitan ng Intel at EP3SL70F780I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780C4L | EP3SL70F780I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | 67,500 |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 40 nm TSMC |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | 3 (Medium) |
| Temperature na Operasyon | 0C to 85C (commercial) | -40C to +100C (Industrial) |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Family | — | Stratix III L |
| Adaptive Logic Modules (ALM) | — | 27,000 ALM |
| Embedded Memory | — | 2,699,264 bits (2.57 Mbit) |
| User I/Os | — | 488 |
| Packhaging | — | 780-BBGA, FCBGA (29x29 mm) |
| Core Voltage (VCCINT) | — | 1.1 V |
| Uri ng Memory | — | SRAM-based, external configuration |
| DSP Blocks | — | Multipliers, count varies by die |
| Configuration | — | External (EPCS / JTAG) |
| Tindminan RoHS | — | Compliant |
| Packaging | — | Tray |