EP3SL70F780I3 vs EP3SL70F780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I3 sa pamamagitan ng Intel at EP3SL70F780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL70F780I3 | EP3SL70F780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III L | — |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| Temperature na Operasyon | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I3 (industrial) | I4 |
| Core Voltage | 1.1 V | — |
| Process Node | 65 nm | — |
| Packhaging | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | 780-ball FC-FBGA |
| Package Code | BGA780,28X28,40 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Series | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory | — | 2,699,264 bits |
| DSP Blocks (18x18 Multipliers) | — | 384 |
| User I/O Pins | — | 488 |
| PLLs | — | 8 |
| Global Clock Networks | — | 48 |
| Process Technology | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.1 V |
| Lead-Free | — | Yes |
| Configuration Interface | — | JTAG, Serial Passive, Serial Active |