EP3SL70F780I3G vs EP3SL70F780C4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I3G sa pamamagitan ng Intel at EP3SL70F780C4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I3G | EP3SL70F780C4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 67,500 | — |
| Adaptive Logic Modules (ALM) | 27,000 ALM | — |
| Embedded Memory | 2,699,264 bits (2.57 Mbit) | — |
| User I/Os | 488 | — |
| Packhaging | 780-BBGA, FCBGA (29x29 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Core Voltage (VCCINT) | 1.1 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Process Technology | 40 nm TSMC | 65 nm |
| Uri ng Memory | SRAM-based, external configuration | — |
| DSP Blocks | Multipliers, count varies by die | — |
| Configuration | External (EPCS / JTAG) | — |
| Tindminan RoHS | Compliant | Compliant |
| Packaging | Tray | — |
| Speed Grade | 3 (Medium) | — |
| Logic Elements | — | 67,500 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total RAM Bits | — | 2,699,264 |
| User I/O Pins | — | 488 |
| Bilang ng Pins | — | 780 |
| Package Type | — | 780-FBGA (FCBGA) |
| Package Dimensions | — | 29 x 29 mm |
| Core Voltage Range | — | 0.86 V to 1.15 V |
| Temperature ng Junction na Operasyon | — | 0C to 85C (commercial) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Quartus II (legacy Stratix III support) |