EP3SL70F780I4G vs EP3SL70F780C4G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I4G sa pamamagitan ng Intel at EP3SL70F780C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F780I4G EP3SL70F780C4G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Family Stratix III L Stratix III L
Series EP3SL70 —
Logic Elements 67,500 —
Embedded Memory Bits 2,699,264 —
User I/O Count 488 —
Packhaging 780-ball FineLine BGA (FBGA) 780-ball FCBGA (Flip-Chip BGA)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (SMD/SMT)
Hanay ng Temperature na Operasyon -40C to +100C (Industrial) 0C to +85C (Commercial)
Speed Grade I4 (Industrial, mid-speed) C4 (commercial)
Process Technology TSMC 40 nm —
Supply Voltage - Core [DATA_NEEDED: Vccint nominal value] —
Supply Voltage - I/O [DATA_NEEDED: Vccio bank range] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Transceivers [DATA_NEEDED: high-speed transceiver count] —
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Level ng MSL 3 (168 hours) 3
Logic Elements (LE) — 67,500
Adaptive Logic Modules (ALM) — 27,000
Embedded Memory — 2,699,264 bits (2.57 Mbit)
Maximum User I/O — 488
Operating Supply Voltage (Core) — 1.1 V
Process Node — 40 nm TSMC low-power
Number of PLLs — 8
DSP Multipliers (18x18) — [DATA_NEEDED: DSP block count]
Configuration Modes — PS, FPP, AS, JTAG

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