EP3SL70F780I4LG vs EP3SL50F780I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I4LG sa pamamagitan ng Altera at EP3SL50F780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I4LG | EP3SL50F780I4L |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 LE | 47,500 |
| Adaptive Logic Modules (ALMs) | 27,000 ALM | — |
| Embedded Memory | 2.57 Mbit | — |
| Number of I/Os | 488 I/O | — |
| Core Voltage | 1.1 V | 0.9 V |
| Temperature na Operasyon | -40C to +100C (Industrial, I4) | -40C to +100C (Industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Process Technology | 40 nm | 65 nm CMOS |
| Style ng Pagpapasok | SMD/SMT | — |
| Number of Logic Array Blocks (LABs) | 2700 | — |
| Total Block RAM Bits | 2,699,264 bits | — |
| DSP Blocks | Present (refer to device handbook) | — |
| Tindminan RoHS | Compliant | — |
| Ordering Code Suffix 'G' | Indicates Flip-Chip BGA package | — |
| Embedded Memory (bits) | — | 2,184,192 |
| User I/O Count | — | 488 |
| I/O Banks | — | 8 |
| Packhaging | — | 780-BBGA, FCBGA (29 mm) |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Speed Grade | — | I4 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Configuration Memory | — | SRAM-based, volatile |
| Design Suite | — | Quartus II / Quartus Prime (Stratix III support) |
| Device Sub-Family | — | Low-Power (L) |
| Country of Origin | — | [DATA_NEEDED: COO not specified in source data] |