EP3SL70F780I4LG vs EP3SL70F780I4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I4LG sa pamamagitan ng Altera at EP3SL70F780I4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I4LG | EP3SL70F780I4G |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 LE | 67,500 |
| Adaptive Logic Modules (ALMs) | 27,000 ALM | — |
| Embedded Memory | 2.57 Mbit | — |
| Number of I/Os | 488 I/O | — |
| Core Voltage | 1.1 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial, I4) | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Process Technology | 40 nm | TSMC 40 nm |
| Style ng Pagpapasok | SMD/SMT | — |
| Number of Logic Array Blocks (LABs) | 2700 | — |
| Total Block RAM Bits | 2,699,264 bits | — |
| DSP Blocks | Present (refer to device handbook) | [DATA_NEEDED: number of DSP blocks] |
| Tindminan RoHS | Compliant | Compliant |
| Ordering Code Suffix 'G' | Indicates Flip-Chip BGA package | — |
| Series | — | EP3SL70 |
| Embedded Memory Bits | — | 2,699,264 |
| User I/O Count | — | 488 |
| Packhaging | — | 780-ball FineLine BGA (FBGA) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Speed Grade | — | I4 (Industrial, mid-speed) |
| Supply Voltage - Core | — | [DATA_NEEDED: Vccint nominal value] |
| Supply Voltage - I/O | — | [DATA_NEEDED: Vccio bank range] |
| Transceivers | — | [DATA_NEEDED: high-speed transceiver count] |
| Lead-Free | — | Yes |
| Level ng MSL | — | 3 (168 hours) |