EP3SL70F780I4LG vs EP3SL70F780I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I4LG sa pamamagitan ng Altera at EP3SL70F780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I4LG | EP3SL70F780I4L |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 LE | 67,500 |
| Adaptive Logic Modules (ALMs) | 27,000 ALM | — |
| Embedded Memory | 2.57 Mbit | — |
| Number of I/Os | 488 I/O | — |
| Core Voltage | 1.1 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial, I4) | -40C to +100C (industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Process Technology | 40 nm | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Number of Logic Array Blocks (LABs) | 2700 | — |
| Total Block RAM Bits | 2,699,264 bits | — |
| DSP Blocks | Present (refer to device handbook) | [DATA_NEEDED: DSP block count] |
| Tindminan RoHS | Compliant | Compliant |
| Ordering Code Suffix 'G' | Indicates Flip-Chip BGA package | — |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory Bits | — | 2,699,264 |
| User I/O Pins | — | 488 |
| Packhaging | — | 780-ball FBGA (FineLine BGA) |
| Speed Grade | — | I4 |
| Power Variant | — | L (low static power) |
| Process Node | — | 40 nm |
| Configuration Method | — | Serial / Parallel / JTAG via Quartus II |
| Transceivers | — | None (logic/transceiver-less L variant) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |