EP4CE22E22C8N vs EP4CE15E22C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE22E22C8N sa pamamagitan ng Altera at EP4CE15E22C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CE15E22C8N - Cyclone IV E FPGA, 15K LE, 144-EQFP | Intel / Altera
EP4CE15E22C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CE22E22C8N | EP4CE15E22C8N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Cyclone IV E field-programmable gate array (FPGA) | — |
| Logic Elements | 22,320 logic elements | — |
| Embedded Memory | 608,256 bits | — |
| I/O Count | 79 I/Os | — |
| Maximum Device Frequency | 472.5 MHz | — |
| Core Supply Voltage Range | 1.15 V to 1.25 V | — |
| Packhaging | 144-LQFP exposed pad | 144-pin EQFP (Enhanced QFP) with Exposed Pad |
| Package Pin Count | 144 pins | — |
| Technology | 60 nm FPGA process | — |
| PLL Support | Supported | — |
| Programmability | User-programmable FPGA logic | — |
| Logic Cell Type | LE | — |
| Product Series | Cyclone IV E | — |
| Variant | EP4CE22 E22 | — |
| Ordering Part Number | EP4CE22E22C8N | — |
| Style ng Pagpapasok | Surface mount | — |
| Thermal Pad | Exposed pad | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0C to +85C (Commercial) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone IV E |
| Logic Elements (LEs) | — | 15,408 |
| Embedded Memory (Bits) | — | 516,096 |
| Embedded Memory (Kbits) | — | 504 |
| Embedded 18x18 Multipliers | — | 56 |
| General Purpose PLLs | — | 4 |
| User I/O Pins | — | 81 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | 8 |
| Uri ng Pagpapasok | — | Surface Mount |
| Level ng MSL | — | 3 |
| Process Technology | — | 60 nm low-power CMOS |
| Configuration Method | — | SRAM-based, AS / PS / JTAG |