EP4CE55F23C7N vs EP4CE55F23C8LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23C7N sa pamamagitan ng Intel at EP4CE55F23C8LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F23C7N | EP4CE55F23C8LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits |
| Maximum User I/O | 324 | — |
| Embedded 18x18 Multipliers | 66 | 156 |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | 20 |
| Maximum Operating Frequency | 472.5 MHz (C7 speed grade) | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Packhaging | 484-FBGA (F23) 23 x 23 mm, 1.0 mm pitch | 484-pin FBGA (FBGA-484) |
| Temperature na Operasyon | 0C to +85C (commercial, C7) | 0C to +85C (commercial) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Device Logic Elements | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Maximum User I/Os | — | 324 |
| Core Voltage | — | 1.2 V |
| Package Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | C8 |
| Device Type | — | FPGA |