EP4CE75F23I8L vs EP4CE75F23I8LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE75F23I8L sa pamamagitan ng Intel at EP4CE75F23I8LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE75F23I8L | EP4CE75F23I8LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E (EP4CE75) |
| Logic Elements | 75,408 | — |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 bits |
| Number of M9K Memory Blocks | 305 | — |
| Embedded 18x18 Multipliers | 274 | — |
| User I/O Pins | 292 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 292 | — |
| Packhaging | 484-ball FBGA | 484-ball FBGA (F23) 1.0 mm pitch |
| Temperature na Operasyon | -40C to +85C (Industrial) | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 1.0 V / 1.2 V | — |
| I/O Standards Supported | LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL | — |
| Configuration Modes | AS, PS, FPP, JTAG | JTAG, AS, PS, FPP |
| Process Node | 60 nm low-leakage | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | 3 |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Series | — | Cyclone IV E |
| Logic Elements (LE) | — | 75,408 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory (M9K blocks) | — | 305 blocks |
| Embedded 18 x 18 Multipliers | — | 244 |
| General-purpose PLLs | — | 4 |
| Maximum User I/Os | — | 292 |
| User I/O Banks | — | 8 |
| Supply Voltage - Core | — | 1.2 V |
| Process Technology | — | 60 nm low-power CMOS |