EP4CGX110DF27I7N vs EP4CGX150DF27C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF27I7N sa pamamagitan ng Intel at EP4CGX150DF27C7 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX110DF27I7N - Cyclone IV GX FPGA, 110K LEs, 672-FBGA | Intel
EP4CGX110DF27I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX110DF27I7N | EP4CGX150DF27C7 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | — |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | 8 |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 672-ball FBGA, 1.0 mm pitch | 672-ball FBGA (F27), 27 × 27 mm |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 149,760 |
| Total Memory Bits | — | 6,635,520 |
| Maximum User I/O | — | 393 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | -7 (commercial) |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| Embedded Memory | — | 720 Kbits (M9K blocks) |
| Hardware Multipliers | — | 360 (18 × 18) |
| Transceiver Protocols | — | PCIe Gen1, Gigabit Ethernet, Serial RapidIO, CPRI |
| Configuration | — | SRAM-based (EPCS/EPCQ flash required) |