EP4CGX15BF14C6N vs EP4CGX15BF14C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX15BF14C6N sa pamamagitan ng Intel at EP4CGX15BF14C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX15BF14C6N | EP4CGX15BF14C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | — |
| Logic Elements | 14,400 | 14,400 |
| Embedded Memory | 552,960 bits (540 Kbits) | 552,960 bits |
| Embedded 18x18 Multipliers | 56 | — |
| General-Purpose I/O | 72 | — |
| Maximum User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 (commercial) | C7 (commercial) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to 85C (commercial) |
| Packhaging | 169-LBGA (FBGA) | 169-FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Schemes | AS, JTAG | — |
| Device Family | — | Cyclone IV GX |
| User I/Os | — | 72 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| Embedded Multipliers (18x18) | — | 56 |
| PLLs | — | 4 |
| Memory Interface Support | — | DDR2 |